Size:7.0” Product Structure:G+G
Resolution:800*480 Pixel Pitch:0.0635*0.1905mm
Viewing Angle:75/60 Active Area:0.1905*0.1905mm
Brightness:450cd/m2 Contrast Ratio:350:1
Number of Pins:40 Pin Pitch:0.5mm
Connection Type:ZIF Operating Voltage:3.3V
Aspect Ratio:15:9 Active Area:165*104mm
Viewing Area:152.4*91.44mm Module Thickness:6.7mm
Surface Hardness:6H@750 Transmittance:≥89%
Controller IC:Integrated type Interface Type:IC2
Outline Dimension CG:187.1*139.8mm Operating Temperature:-30~80℃
FPC Position:Middle exit on long side Storage Temperature:-40~80℃
FPC Length:Bent (flex) cable 40pin Application Field:Industrial
Anti blackening
the screen content can be clearly seen from any angle.
"3A" processing
Simultaneously equipped with AG+AR+AF processing.
Low-power consumption
Extremely low power consumption, the lowest in the industry.
High sensitivity
Fast scanning and refresh rate, startup below 30MS, excellent accuracy and linearity.
Anti-noise
Hardware and firmware can be matched to meet strict EMI/RFI standards.
Optical binding
After full bonding, the screen's seismic resistance is increased, reducing the chance of damage.
01
COG/Fully automatic binding process This process is mainly to bind the IC and FPC to the LCD panel until the FOG is formed.
02
LCM-Fully automatic film process In this process, FOG and BLD are bonded until LCM is formed.
03
Post film process This process is mainly to attach the auxiliary materials to the formed LCM.
04
LCM electrical burning test This process is mainly to test the performance of the formed LCM.
05
TLCM/Automatic film process This process is mainly to bond LCM and TP until TLCM state.
06
Defoaming furnace process This process is mainly to defoam the laminated TLCM.
07
FQCinspection area This process is mainly to carry out the final process test of the laminated TLCM finished product.
08
Outgoing quality control This process is mainly for TLCM finished product quality inspection before shipment.